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ISO 9455-14:2017

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ISO 9455-14:2017 Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues

standard by International Organization for Standardization, 08/01/2017

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ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

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Published: 08/01/2017 Number of Pages: 10File Size: 1 file , 350 KB Same As: BS EN ISO 9455-14:2017