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EIA JEP 170:2013

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EIA JEP 170:2013

Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)

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This publication provides description of defects observed in FCxGA components that can adversely impact end-user products and/or applications. It will also provide illustration on other defects that may be considered visual nonconformities since they should be less disruptive of quality or reliability to customer products. Finally, it will depict a method for visual inspection that can be utilized to identify these defects or visual nonconformities and guidance for disposition. Official criteria for product acceptance should be in actual product drawings and specifications.

Author EIA
Editor EIA
Document type Standard
Format File
ICS 31.200 : Integrated circuits. Microelectronics
Number of pages 18
Year 2013
Document history
Country USA
Keyword EIA 170;170;EIA JEP170