EIA JESD 22-B115A.01:2016

This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force/energy testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force, fracture energy and failure mode data are collected and analyzed. Other specialized solder ball pull methods using a heated thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document. Both low- and high-speed testing are covered by this document. Depending on test sample configuration, application and purpose of the test (characterization, qualification, production, etc.), other solder joint integrity assessment methods such as JEDEC Solder Ball Shear Test Method JESD22-B117, may be more appropriate. Generally, solder ball pull is most appropriate for devices that experience tensile loading during either the manufacturing/shipment process or end use, and have non-oblate (spherical, non-flattened) solder balls. This test method is used to assess the ability of solder balls to withstand mechanical pull forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. To provide a tensile load, this solder joint integrity assessment technique employs mechanical jaws to clamp an individual solder ball of a free (unmounted) test sample. Solder ball pull is a destructive test.