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EIA JESD 9C:2017

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EIA JESD 9C:2017

Inspection Criteria for Microelectronic Packages and Covers

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This standard establishes the inspection criteria for metal and ceramic hermetic packages, individual feed throughs, and covers (lids).

Author EIA
Editor EIA
Document type Standard
Format File
ICS 35.160 : Microprocessor systems
Number of pages 82
Replace EIA JESD 9B (2011-05)
Year 2017
Document history EIA JESD 9C (2017-05)
Country USA
Keyword EIA 9C;9C;EIA JESD9C