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EIA JEP 001-2A:2018

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EIA JEP 001-2A:2018

FOUNDRY PROCESS QUALIFICATION GUIDELINES - FRONT END TRANSISTOR LEVEL (Wafer Fabrication Manufacturing Sites)

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This document describes transistor-level test and data methods for the qualification of semiconductor technologies. It does not give pass or fail values or recommend specific test equipment, test structures or test algorithms. Wherever possible, it references applicable JEDEC such as JESD47 or other widely accepted standards for requirements documentation. There are two levels of qualification described. Level 1 is a pure process qualification intended to find reliability weaknesses. It primarily addresses technology wearout mechanisms through package or wafer level reliability tests on specially designed test structures. Level 2 demonstrates the reliability of the process that corresponds to the reliability demands from projected or known applications. Level 2 testing can be implemented via the testing of a relevant functional technology qualification vehicle (TQV), including life test. The level 2 tests are described in Section 12. Other Reporting requirements (e.g., PCM data) are also included.

Author EIA
Editor EIA
Document type Standard
Format File
ICS 77.140.80 : Iron and steel castings
Number of pages 36
Modify EIA JEP 001A (2014-02)
Year 2018
Document history
Country USA
Keyword EIA JEP 001;EIA 001;EIA 001.2A;001;EIA JEP001-2A