EIA JESD 237:2014

This standard describes a baseline set of acceptance tests for use in qualifying power amplifier modules as an individual new product, a product family, or as products in a process which is being changed. These tests are capable of stimulating and precipitating semiconductor device, internal component, laminate, and packaging failures. The objective is to precipitate failures in an accelerated manner compared to use conditions. Failure rate projections usually require larger sample sizes than are called out in qualification testing and durations or stresses which would exacerbate normal wearout. For guidance on projecting failure rates, refer to JESD85 Methods for Calculating Failure Rates in Units of FITs. This qualification standard is not aimed at extreme use conditions such as military applications, automotive under-the-hood applications, or uncontrolled avionics environments, nor does it address 2nd level reliability considerations, which are addressed in JEP150. This set of tests should not be used indiscriminately. Each qualification project should be examined for: a) Any potential new and unique failure mechanisms. b) Any situations where these tests/conditions may induce invalid or overstress failures. If it is known or suspected that failures either are due to new mechanisms or are uniquely induced by the severity of the test conditions, then the application of the test condition as stated is not recommended. Alternatively, new mechanisms or uniquely problematic stress levels should be addressed by building an understanding of the mechanism and its behavior with respect to accelerated stress conditions (Ref. JESD91 Method for Developing Acceleration Models for Electronic Component Failure Mechanisms.) Another alternative qualification method is described in JESD94 Application Specific Qualification using Knowledge Based Test Methodology. This technique involves establishing the (worst case) use conditions and tailoring the stress methods, stress levels, and durations to match the use conditions. Since the assembly is considered an integral part of the power amplifier module, this standard includes the applicable package-related stresses. However, if special consideration of assembly-level effects is necessary, then guidance from JEP150, Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid State Surface-Mount Components, is recommended.