PICMG 3.0 R3.0

The PICMG® 3.0 specification defines open architecture modular computing components that can be quickly integrated to deploy high performance services solutions. The specification is focused on the definition of an architecture that can:
Enable reduced development time and costs
Support reduced total cost of ownership
Apply to edge, core, transport, and data center
Apply to wireless, wireline, and optical network elements
Support a rich mix of processors, digital signal processors (DSPs), packet processors, storage, and input/output (I/O)
Integrate with multiple network elements
Provide multi-protocol support for interfaces up to 40 Gbps
Offer high levels of modularity and configurability
Improve volumetric efficiency
Improve power distribution and management
Offer an advanced software infrastructure providing operating systems (OSs),
application programming interface (API), and operation, administration, management,
and provisioning (OAM&P)
Offer world-class element cost and operational expense
Provide high levels of service availability (99.999% and greater) through the integration of features for resiliency, redundancy, serviceability and manageability
Support appropriate scalability of System performance and capacity
The architecture is tailored to meet the needs of the rapidly changing communications network infrastructure. The performance, environment and surrounding regulatory requirements of application types, sometimes referred to as “Central Office,” “carrier-grade” or “service provider” serve as a framework for the definition of the architecture. Industry specifications that are representative of these environments are directly referenced or used as guidelines for the structure of the specification.
Given the pace at which technologies and services are changing, this specification places high priority on cost effectiveness versus attempting to support a variety of potential future technologies at the expense of cost and complexity. While the specification is founded on the
requirements of the communications infrastructure, it is extensible to a variety of applications and environments where highly available, highly scalable, cost effective, open architecture modular solutions are required.
Objectives
The objective of this document is to present base requirements, and, in some cases, suggest implementations for the PICMG® 3.0 Specification. Included is detailed information of the following elements that must be considered during development:
Mechanicals
Hardware platform management
Power distribution
Power Connector zone (for Dual –48 VDC power to each Slot)
Rear I/O access zone
Data transport Connector zone (for management and switching fabric interconnect)
Shelf thermal dissipation
Regulatory guidelines