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For high pin count components (e. g., ball grid array) with a large number of signal pins, the total number of pins can be reduced by splitting the signal pins into two or more equal sets or subgroups. Special test fixture boards (TFBs) can be constructed to connect each set of signal pins to specific tester channels while floating the remaining unused signal pins. Additional TFBs can be constructed to connect each remaining set of signal pins to specific tester channels while floating the remaining unused signal pins. All power, ground and control pins on the component should be wired to each TFB.
Author | ESD |
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Editor | ESD |
Document type | Standard |
Format | File |
Confirmation date | 2013-07-29 |
ICS | 13.260 : Protection against electric shock. Live working
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Replace | ANSI/ESD SP 5.1.1 (2006) |
Year | 2012 |
Document history | ANSI/ESD SP 5.2.2 (2012) |
Country | USA |
Keyword | ANSI 5;ANSI/ESD SP 5;ANSI/ESD 5;5;ANSI/ESD SP5.2.2-2012 |